MacWorld Expo is just a week away and rumors about new Apple products are flying high. Today, a Chinese language newspaper, Economic Daily, claimed that Foxconn has secured a contract with Apple to manufacture the upcoming iMac all-in-one desktops. The Economic Daily says that Foxconn Group’s Foxconn Precision Components and Catcher Technology will produce the new “magnesium-aluminum alloy chassis” for the upcoming iMac. The use of new alloy will decrease weight while increases the structural strength of the new iMac.
The newspaper further claims that Apple has developed a new cooling technology for the iMacs. Foxconn Precision Components and Auras Technology would team-up to supply this new PC cooling module. Many bloggers believe that Apple will use the new cooling module, as the company is planning to use Intel’s new quad-core desktop chips that have 65W TDP in place of mobile Core 2 Duo chips found on present iMac that have 35W TDP. Intel will be launching the new low-voltage quad-core chips in January, which will include Core 2 Quad Q8200 (2.33GHZ), Core 2 Quad Q9400 (2.66GHz) and Core 2 Quad Q9550 (2.83GHz). These chips will be the likely candidates to replace present iMac Core 2 Duo processors.
In just one weeks time we will find out more at the Macworld Expo 2009.
[Via AppleInsider]