Qualcomm today announced that it is sampling the industry’s first chipsets for dual-carrier HSPA+ and multi-mode 3G/LTE. The MDM8220 is the first chipset to support Dual carrier High-Speed Packet Access Plus; and the MDM9200 and the MDM9600 chipsets are the industry’s first multi-mode 3G/Long Term Evolution (LTE) solutions.

Qualcomm's MDM8220 dual-carrier HSPA+ solution, based on the 3GPP Release 8 standard, provides peak downlink data rates of up to 42 megabits per second (Mbps) and 11 Mbps on the uplink, allowing carriers to easily upgrade their existing infrastructure equipment to achieve significantly higher bandwidths. Its dual-carrier technology doubles networks' bandwidth from 5 MHz to 10 MHz by aggregating two HSPA carriers in parallel.

The MDM9200 and the MDM9600 chipsets are the industry's first multi-mode 3G/LTE solutions that allow UMTS and CDMA2000 operators to upgrade seamlessly to future LTE services while preserving backward compatibility to their existing 3G networks. MDM9200 supports UMTS, HSPA+ and LTE, while the MDM9600 supports CDMA2000 1X, EV-DO Rev. B, SV-DO, SV-LTE, UMTS, HSPA+ and LTE. All of the new chipsets support FDD LTE and TDD LTE modes and different carrier bandwidths, and are capable of using orthogonal frequency division multiple access (OFDMA) and multiple-input and multiple-output (MIMO) antenna technology to support peak data rates of up to 100 Mbps on the downlink and 50 Mbps on the uplink.

Qualcomm is working with numerous network operators, infrastructure vendors and device manufacturers with its dual-carrier HSPA+ and/or LTE solutions. Among multiple network operators evaluating the new technologies are Japan's EMOBILE Ltd. and Telstra Wireless. Qualcomm is also working with multiple infrastructure vendors, such as Huawei Technologies and Nokia Siemens Networks, to perform interoperability tests for dual-carrier HSPA+ and LTE. Among the many device manufacturers currently evaluating the new chipsets are Huawei, LG Electronics, Novatel Wireless, Sierra Wireless and ZTE.