Samsung has announced that it has developed an new approach to NAND flash chip design that can fit 32GB of memory on to a single NAND chip that measures just 0.6mm (0.023-inch). To achieve this Samsung uses new extra-thin, “bare” packages that are half as thick as before but are just as sturdy.

Also, Samsung uses the new 30nm process technology for manufacturing of the new NAND memory. Combining the two new technologies results in NAND chips that are 40 percent thinner and lighter than previous generation NAND chips. Samsung will aim for smartphones and PMP market with the new NAND chip, as these chips could offer up to 128GB storage on devices like the iPhone. Samsung plans to start sampling the chip later this year, but no production date has been set yet.
[Via Electronista]