IBM and 3M Developing 3D Semiconductors with New Types of Adhesives

Submitted by lalit on September 7, 2011 - 9:34pm.

IBM and 3M today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers." The companies are aiming to create a new class of materials, which will make it possible to build, for the first time, commercial microprocessors composed of layers of up to 100 separate chips.

Such stacking would allow for dramatically higher levels of integration for information technology and consumer electronics applications. Processors could be tightly packed with memory and networking, for example, into a "brick" of silicon that would create a computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.

The companies' work can potentially leapfrog today's current attempts at stacking chips vertically – known as 3D packaging. The joint research tackles some of the thorniest technical issues underlying the industry's move to true 3D chip forms. For example, new types of adhesives are needed that can efficiently conduct heat through a densely packed stack of chips and away from heat-sensitive components such as logic circuits.

Many types of semiconductors, including those for servers and games, today require packaging and bonding techniques that can only be applied to individual chips. 3M and IBM plan to develop adhesives that can be applied to silicon wafers, coating hundreds or even thousands of chips at a single time. Current processes are akin to frosting a cake slice-by-slice.

Under the partnership agreement, IBM will draw on its expertise in creating unique semiconductor packaging processes, and 3M will provide its expertise in developing and manufacturing adhesive materials. Check out the video below in which the whole 3D stacking is described. [Via Engadget]