Now that MacBook Air and OS X Lion are out of the way, blogosphere is refocusing their attention on iPad 3 and iPhone 5 rumors. Digitimes is reporting that Taiwan based IC design houses have joined Apple’s supply chain list for iPad 3 production. According to industry sources iPad 3 supply chain will include iML’s integrated programmable gamma/Vcom buffer solutions, Novatek’s LCD driver ICs, Capella’s ambient light sensors and Richtek’s integrated power management ICs. Steven Shen of Digitimes’ believes that Apple is ready to adopt IC solutions from Taiwan based IC design houses to bring down the cost of iPad 3 production, which will have Retina display.

In next generation iPhone related news, CENS is reporting that Taiwan-based TPK Holdings Ltd, is expected to receive 70-80% of touch panel orders for next generation iPhone. TPK is the world’s largest touch panel maker by output and has yield rate of 92-93%, which is needed by Apple for large-scale production of iPhones required for fall launch.

The most interesting news of the day came from MobileFun.co.uk, they posted two mockups of iPhone 5 case that is designed by a Chinese manufacturer. The mockups show that the next generation iPhone will have a bigger display (about 4-inch), redesigned home button and MacBook Air like teardrop design. Joshua Topolsky was first to report about the complete redesign of iPhone 5 on This is my next in April. And it looks like he was right about the redesign rumors.